Invention Grant
- Patent Title: Method and solder for form-fitted joining of two surfaces
- Patent Title (中): 两种表面形状配合接合的方法和焊料
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Application No.: US12827581Application Date: 2010-06-30
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Publication No.: US08641856B2Publication Date: 2014-02-04
- Inventor: Beat Krattiger
- Applicant: Beat Krattiger
- Applicant Address: DE
- Assignee: Storz Endoskop Produktions GmbH
- Current Assignee: Storz Endoskop Produktions GmbH
- Current Assignee Address: DE
- Agency: St. Onge Steward Johnston & Reens LLC
- Priority: DE102009031261 20090630
- Main IPC: B29C65/14
- IPC: B29C65/14
Abstract:
A method for adhesive bond joining of two surfaces, where a metallic or non-metallic solder is applied to at least one of the two surfaces, where the solder has a temperature-dependent optical property. The solder is radiated with electromagnetic radiation with a predetermined spectrum, such that the solder reaches a predetermined temperature above its melting temperature and moistens the surfaces, such that the temperature-dependent optical property is modified reversibly or irreversibly at the predetermined temperature of the solder. The solder is cooled to below its melting temperature, such that the solder solidifies and connects the surfaces in an adhesive bond.
Public/Granted literature
- US20110100545A1 Method and solder for form-fitted joining of two surfaces Public/Granted day:2011-05-05
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