Invention Grant
US08641954B2 Method for fabricating soft mold and pattern forming method using the same
有权
软模的制造方法及使用其的图案形成方法
- Patent Title: Method for fabricating soft mold and pattern forming method using the same
- Patent Title (中): 软模的制造方法及使用其的图案形成方法
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Application No.: US11819934Application Date: 2007-06-29
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Publication No.: US08641954B2Publication Date: 2014-02-04
- Inventor: Jin-Wuk Kim
- Applicant: Jin-Wuk Kim
- Applicant Address: KR Seoul
- Assignee: LG Display Co., Ltd.
- Current Assignee: LG Display Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge, LLP
- Priority: KR10-2006-0059969 20060629
- Main IPC: B29C33/40
- IPC: B29C33/40 ; B29C67/00 ; B28B7/36

Abstract:
A method for forming a soft mold includes providing a master mold having at least one pattern thereon, forming pre-polymer layer on the master mold, applying water on the pre-polymer layer, hardening the pre-polymer layer to form a soft mold, removing water, and separating the soft mold from the master mold. A method for forming a pattern comprises forming a resist on an etching subject layer, providing a soft mold, disposing the soft mold on the resist, separating the soft mold from the resist to form the resist pattern, and etching the etching subject layer by using the resist pattern, wherein providing the soft mold comprises providing a master mold having at least one pattern thereon, forming pre-polymer layer on the master mold, applying water on the pre-polymer layer, hardening the pre-polymer layer to form a soft mold, removing water, and separating the soft mold from the master mold.
Public/Granted literature
- US20080000877A1 Method for fabricating soft mold and pattern forming method using the same Public/Granted day:2008-01-03
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