Invention Grant
- Patent Title: One-dimensional arrays of block copolymer cylinders and applications thereof
- Patent Title (中): 嵌段共聚物圆筒的一维阵列及其应用
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Application No.: US13312383Application Date: 2011-12-06
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Publication No.: US08642157B2Publication Date: 2014-02-04
- Inventor: Dan B. Millward , Karl Stuen
- Applicant: Dan B. Millward , Karl Stuen
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: B32B5/12
- IPC: B32B5/12
Abstract:
Methods for fabricating sub-lithographic, nanoscale microstructures in one-dimensional arrays utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.
Public/Granted literature
- US20120076978A1 One-Dimensional Arrays of Block Copolymer Cylinders and Applications Thereof Public/Granted day:2012-03-29
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