Invention Grant
- Patent Title: Composite substrates with predetermined porosities
- Patent Title (中): 具有预定孔隙率的复合基材
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Application No.: US13233627Application Date: 2011-09-15
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Publication No.: US08642164B2Publication Date: 2014-02-04
- Inventor: Charles R. Watson , John H. Vontell
- Applicant: Charles R. Watson , John H. Vontell
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Main IPC: B32B7/02
- IPC: B32B7/02 ; B32B3/26 ; G01D18/00 ; G01N3/62 ; G01S7/497 ; G01C25/00
Abstract:
A porous composite substrate that includes reinforcement material disposed within a resin matrix. The resin matrix includes a first matrix region with a first density, and a second matrix region with a second density that is different than the first density. The first matrix region includes a plurality of pores that are formed by pore forming material.
Public/Granted literature
- US20130071603A1 COMPOSITE SUBSTRATES WITH PREDETERMINED POROSITIES Public/Granted day:2013-03-21
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