Invention Grant
- Patent Title: High-pressure fluid supply apparatus
- Patent Title (中): 高压流体供给装置
-
Application No.: US13145035Application Date: 2009-01-19
-
Publication No.: US08642225B2Publication Date: 2014-02-04
- Inventor: Tsukuo Ishitoya
- Applicant: Tsukuo Ishitoya
- Applicant Address: JP Toyota-Shi
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-Shi
- Agency: Kenyon & Kenyon LLP
- International Application: PCT/JP2009/050646 WO 20090119
- International Announcement: WO2010/082348 WO 20100722
- Main IPC: H01M8/04
- IPC: H01M8/04 ; F17D1/04 ; F17D1/02

Abstract:
A high-pressure fluid supply apparatus that avoids gas leakage due to a reduction in the performance of a seal member provided inside piping is provided. A high-pressure fluid supply apparatus is provided, the apparatus including: piping that supplies a fluid from a high-pressure fluid supply source to a fluid utilizing device via a first valve device and a second valve device; a seal member that is arranged at a pipe part between the first and second valve devices in order to maintain sealing property of the pipe part, the seal member being made of an elastic material; and a control unit that controls closing and opening of the first and second valve devices to be able to adjust a pressure variation rate of the fluid in the pipe part, wherein the control unit adjusts the pressure variation rate in accordance with a temperature of the seal member.
Public/Granted literature
- US20110269045A1 HIGH-PRESSURE FLUID SUPPLY APPARATUS Public/Granted day:2011-11-03
Information query