Invention Grant
US08642383B2 Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires
有权
双管芯封装结构具有通过凸块电极和接合线外部同时连接的管芯
- Patent Title: Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires
- Patent Title (中): 双管芯封装结构具有通过凸块电极和接合线外部同时连接的管芯
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Application No.: US11536502Application Date: 2006-09-28
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Publication No.: US08642383B2Publication Date: 2014-02-04
- Inventor: Jong-Woo Ha , BumJoon Hong
- Applicant: Jong-Woo Ha , BumJoon Hong
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L25/11
- IPC: H01L25/11
Abstract:
An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; connecting a first device to the first lead-finger system with a wire bond; stacking a second device over the first device; and connecting the second device to the second lead-finger system with a bump bond.
Public/Granted literature
- US20080079130A1 INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING BUMP TECHNOLOGY Public/Granted day:2008-04-03
Information query
IPC分类:
