Invention Grant
- Patent Title: Tape residue-free bump area after wafer back grinding
- Patent Title (中): 晶圆后磨后胶带无残留区域
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Application No.: US12726317Application Date: 2010-03-17
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Publication No.: US08642390B2Publication Date: 2014-02-04
- Inventor: Chung Yu Wang , Jiann-Jong Wang
- Applicant: Chung Yu Wang , Jiann-Jong Wang
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/46
Abstract:
Organic-adhesive tapes are often used to secure and protect the bumps during wafer processing after bump formation. While residual organic-adhesive tape may remain on the wafer after tape de-lamination, applying a bump template layer on the bumps before laminating the tape allows any residue to be removed afterwards and results in a residue-free wafer.
Public/Granted literature
- US20110230043A1 TAPE RESIDUE-FREE BUMP AREA AFTER WAFER BACK GRINDING Public/Granted day:2011-09-22
Information query
IPC分类:
