Invention Grant
- Patent Title: Method of manufacturing electronic device on leadframe
- Patent Title (中): 在引线框架上制造电子器件的方法
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Application No.: US12020821Application Date: 2008-01-28
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Publication No.: US08642394B2Publication Date: 2014-02-04
- Inventor: Abdul Rahman Mohamed , Stanley Job Doraisamy , Tien Lai Tan , Ralf Otremba
- Applicant: Abdul Rahman Mohamed , Stanley Job Doraisamy , Tien Lai Tan , Ralf Otremba
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
An electronic device and method of manufacturing. One embodiment includes attaching a first semiconductor chip to a first metallic clip. The first semiconductor chip is placed over a leadframe after the attachment of the first semiconductor chip to the first metallic clip.
Public/Granted literature
- US20090189259A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING Public/Granted day:2009-07-30
Information query
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