Invention Grant
- Patent Title: Formation of strain-inducing films using hydrogenated amorphous silicon
- Patent Title (中): 使用氢化非晶硅形成应变诱导膜
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Application No.: US11521850Application Date: 2006-09-14
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Publication No.: US08642413B2Publication Date: 2014-02-04
- Inventor: Anand S. Murthy , Jeffrey L. Armstrong , Dennis G. Hanken
- Applicant: Anand S. Murthy , Jeffrey L. Armstrong , Dennis G. Hanken
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A method to form a strain-inducing epitaxial film is described. In one embodiment, the strain-inducing epitaxial film is a three-component epitaxial film comprising atoms from a parent film, charge-neutral lattice-substitution atoms and charge-carrier dopant impurity atoms. In another embodiment, the strain-inducing epitaxial film is formed by a multiple deposition/etch cycle sequence involving hydrogenated amorphous silicon, followed by charge carrier dopant and charge-neutral lattice-forming impurity atom implant steps and, finally, a kinetically-driven crystallization process.
Public/Granted literature
- US20080070384A1 Formation of strain-inducing films using hydrogenated amorphous silicon Public/Granted day:2008-03-20
Information query
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