Invention Grant
- Patent Title: Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera
- Patent Title (中): 制造接合基板，接合基板，固态成像装置的制造方法，固态成像装置以及相机的方法
-
Application No.: US12944193Application Date: 2010-11-11
-
Publication No.: US08642444B2Publication Date: 2014-02-04
- Inventor: Nobutoshi Fujii
- Applicant: Nobutoshi Fujii
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2009-272491 20091130
- Main IPC: H01L21/30
- IPC: H01L21/30
Abstract:
Disclosed herein is a method of manufacturing a bonded substrate, including the steps of: forming a first bonding layer on a surface on one side of a semiconductor substrate; forming a second bonding layer on a surface on one side of a support substrate; adhering the first bonding layer and the second bonding layer to each other; a heat treatment for bonding the first bonding layer and the second bonding layer to each other; and thinning the semiconductor substrate from a surface on the other side of the semiconductor substrate to form a semiconductor layer.
Public/Granted literature
Information query
IPC分类:
