Invention Grant
- Patent Title: Side wettable plating for semiconductor chip package
- Patent Title (中): 侧面润湿电镀半导体芯片封装
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Application No.: US13189857Application Date: 2011-07-25
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Publication No.: US08642461B2Publication Date: 2014-02-04
- Inventor: Kenneth J. Huening
- Applicant: Kenneth J. Huening
- Applicant Address: US CA San Jose
- Assignee: Maxim Integrated Products, Inc.
- Current Assignee: Maxim Integrated Products, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Advent, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method for providing a semiconductor chip package with side wettable plating includes singulating a semiconductor chip package from an array of packages formed in a block format, immersing the semiconductor chip package in a bath of plating solution, contacting a lead land of the semiconductor chip package with conductive contact material within the bath of plating solution, connecting the conductive contact material to a cathode electrical potential, connecting an anode within the bath of plating solution to an anode electrical potential, and plating the lead land of the semiconductor chip package.
Public/Granted literature
- US20120032352A1 SIDE WETTABLE PLATING FOR SEMICONDUCTOR CHIP PACKAGE Public/Granted day:2012-02-09
Information query
IPC分类:
