Invention Grant
US08642462B2 Interconnection designs and materials having improved strength and fatigue life
有权
互连设计和材料具有改善的强度和疲劳寿命
- Patent Title: Interconnection designs and materials having improved strength and fatigue life
- Patent Title (中): 互连设计和材料具有改善的强度和疲劳寿命
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Application No.: US12100380Application Date: 2008-04-09
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Publication No.: US08642462B2Publication Date: 2014-02-04
- Inventor: Terry Lee Sterrett , Richard J. Harries
- Applicant: Terry Lee Sterrett , Richard J. Harries
- Applicant Address: US ID Boise
- Assignee: Micorn Technology, Inc.
- Current Assignee: Micorn Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter.
Public/Granted literature
- US20080254611A1 INTERCONNECTION DESIGNS AND MATERIALS HAVING IMPROVED STRENGTH AND FATIGUE LIFE Public/Granted day:2008-10-16
Information query
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