Invention Grant
- Patent Title: Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus
- Patent Title (中): 用于制造和与电子设备进行平面接触的方法,以及相应制造的装置
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Application No.: US12224608Application Date: 2006-12-21
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Publication No.: US08642465B2Publication Date: 2014-02-04
- Inventor: Gernot Schimetta , Maximilian Tschemitz
- Applicant: Gernot Schimetta , Maximilian Tschemitz
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Agency: Staas & Halsey LLP
- Priority: DE102006009723 20060302
- International Application: PCT/EP2006/070110 WO 20061221
- International Announcement: WO2007/098820 WO 20070907
- Main IPC: H01L21/4763
- IPC: H01L21/4763

Abstract:
Reliable electrical contact is made with electronic components and effective electrical isolation is produced between the top and bottom of the electronic components. An electronic component is arranged inside a window in a first layer on a substrate. Next, a second layer is put on such that contact areas on the component and contact points on the first layer are freely accessible. Electrical contacts and electrical connecting lines are produced by electrodeposition. The second layer is used to produce bridges over an interval range between the electronic component and the first layer. The bridges have connecting lines formed on them. The second layer can be removed again. Radio-frequency modules can be produced in compact fashion and can be combined with audio-frequency components.
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Information query
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