Invention Grant
- Patent Title: Method for fabricating patterned polyimide film and applications thereof
- Patent Title (中): 图案化聚酰亚胺膜的制造方法及其应用
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Application No.: US13517804Application Date: 2012-06-14
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Publication No.: US08642485B2Publication Date: 2014-02-04
- Inventor: Chin-Yi Lin
- Applicant: Chin-Yi Lin
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corporation
- Current Assignee: United Microelectronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
A method for fabricating a patterned polyimide film, wherein the method comprises steps as follows: Firstly, a polyimide film is provided on a substrate. A wet planarization process is then performed to remove a portion of the polyimide film. Subsequently the planarized polyimide film is patterned.
Public/Granted literature
- US20130334625A1 METHOD FOR FABRICATING PATTERNED POLYIMIDE FILM AND APPLICATIONS THEREOF Public/Granted day:2013-12-19
Information query
IPC分类:
