Invention Grant
- Patent Title: Multi-step system and method for curing a dielectric film
- Patent Title (中): 用于固化电介质膜的多步骤系统和方法
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Application No.: US12605863Application Date: 2009-10-26
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Publication No.: US08642488B2Publication Date: 2014-02-04
- Inventor: Junjun Liu , Eric M. Lee , Dorel L. Toma
- Applicant: Junjun Liu , Eric M. Lee , Dorel L. Toma
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L21/26
- IPC: H01L21/26
Abstract:
A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such as moisture, in the dielectric film. The system further includes a curing system coupled to the drying system, and configured to treat the dielectric film with ultraviolet (UV) radiation and infrared (IR) radiation in order to cure the dielectric film.
Public/Granted literature
- US20100041248A1 MULTI-STEP SYSTEM AND METHOD FOR CURING A DIELECTRIC FILM Public/Granted day:2010-02-18
Information query
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