Invention Grant
- Patent Title: Circuit board, method of manufacturing the same, and resistance element
- Patent Title (中): 电路板，其制造方法和电阻元件
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Application No.: US12689353Application Date: 2010-01-19
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Publication No.: US08642894B2Publication Date: 2014-02-04
- Inventor: Tomoyuki Abe , Norikazu Ozaki
- Applicant: Tomoyuki Abe , Norikazu Ozaki
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2009-021913 20090202; JP2009-230606 20091002
- Main IPC: H05K1/09
- IPC: H05K1/09
Abstract:
Provided is a circuit board including a resin base, and a resistance element formed above the resin base. The resistance element includes a resistance pattern including an electrode portion and an extending portion, and an electrode formed on the electrode portion of the resistance pattern and including a foot portion reduced in thickness toward the extending portion.
Public/Granted literature
- US20100193225A1 CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND RESISTANCE ELEMENT Public/Granted day:2010-08-05
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