Invention Grant
US08642896B2 Printed circuit board, printed circuit board fabrication method, and electronic device including printed circuit board
有权
印刷电路板，印刷电路板制造方法以及包括印刷电路板的电子设备
- Patent Title: Printed circuit board, printed circuit board fabrication method, and electronic device including printed circuit board
- Patent Title (中): 印刷电路板，印刷电路板制造方法以及包括印刷电路板的电子设备
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Application No.: US12817562Application Date: 2010-06-17
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Publication No.: US08642896B2Publication Date: 2014-02-04
- Inventor: Kenji Fukuzono
- Applicant: Kenji Fukuzono
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2009-149528 20090624
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A printed circuit board include: a printed circuit board main body having a mounting area on a first surface of the printed circuit board main body and a recess being provided at a recess area on a second surface that is a back side of the first surface of the printed circuit board main body, the electronic component being mounted on the mounting area, the recess area being provided to correspond to the mounting area; and a thermal expansion control element being placed in the recess and having a smaller thermal expansion coefficient than the printed circuit board main body.
Public/Granted literature
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