Invention Grant
- Patent Title: Microwave interactive flexible packaging
- Patent Title (中): 微波互动软包装
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Application No.: US13156701Application Date: 2011-06-09
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Publication No.: US08642935B2Publication Date: 2014-02-04
- Inventor: Richard G. Robison , Lorin R. Cole , Timothy H. Bohrer , Scott W. Middleton , Terrence P. Lafferty , Brian R. O'Hagan , Patrick H. Wnek
- Applicant: Richard G. Robison , Lorin R. Cole , Timothy H. Bohrer , Scott W. Middleton , Terrence P. Lafferty , Brian R. O'Hagan , Patrick H. Wnek
- Applicant Address: US GA Marietta
- Assignee: Graphic Packaging International, Inc.
- Current Assignee: Graphic Packaging International, Inc.
- Current Assignee Address: US GA Marietta
- Agency: Womble Carlyle Sandridge & Rice, LLP
- Main IPC: H05B6/80
- IPC: H05B6/80
Abstract:
A microwave energy interactive structure includes a layer of indium tin oxide, which may be supported on a microwave energy transparent substrate. In one embodiment, the microwave energy interactive structure may have at least one of an oxygen transmission rate of less than about 0.05 cc/m2/day and a water vapor transmission rate of less than about 0.09 g/m2/day.
Public/Granted literature
- US20110233202A1 Microwave Interactive Flexible Packaging Public/Granted day:2011-09-29
Information query
