Invention Grant
US08642963B2 Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method 失效
热检测器,热检测装置,电子仪器和热检测器制造方法

  • Patent Title: Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
  • Patent Title (中): 热检测器,热检测装置,电子仪器和热检测器制造方法
  • Application No.: US13329485
    Application Date: 2011-12-19
  • Publication No.: US08642963B2
    Publication Date: 2014-02-04
  • Inventor: Yasushi Tsuchiya
  • Applicant: Yasushi Tsuchiya
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Global IP Counselors, LLP
  • Priority: JP2010-286334 20101222; JP2010-289491 20101227; JP2010-289492 20101227; JP2011-012060 20110124; JP2011-036886 20110223
  • Main IPC: G01J5/08
  • IPC: G01J5/08
Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
Abstract:
A thermal detector includes a substrate; a support member supported on the substrate interposed by a cavity; a heat-detecting element formed on the support member and having a pyroelectric material layer disposed between a lower electrode and an upper electrode; a light-absorbing layer formed on the heat-detecting element; and a thermal transfer member including a connecting portion connected to the heat-detecting element and a thermal collecting portion disposed inside the light-absorbing layer and having a surface area larger than that of the connecting portion in plan view, the thermal collecting portion being optically transmissive at least with respect to light of a prescribed wavelength. The lower electrode has an extending portion extending around the pyroelectric material layer in plan view, and the extending portion has light-reflecting properties by which at least a part of the light transmitted through the thermal collecting portion of the thermal transfer member is reflected.
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