Invention Grant
- Patent Title: Encapsulation of electrodes in solid media for use in conjunction with fluid high voltage isolation
- Patent Title (中): 固体介质中的电极封装,与流体高压隔离结合使用
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Application No.: US13165556Application Date: 2011-06-21
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Publication No.: US08642974B2Publication Date: 2014-02-04
- Inventor: Sean Kellogg , Andrew B. Wells , James B. McGinn , N. William Parker , Mark W. Utlaut , Anthony Graupera
- Applicant: Sean Kellogg , Andrew B. Wells , James B. McGinn , N. William Parker , Mark W. Utlaut , Anthony Graupera
- Applicant Address: US OR Hillsboro
- Assignee: FEI Company
- Current Assignee: FEI Company
- Current Assignee Address: US OR Hillsboro
- Agency: Scheinberg & Associates, PC
- Agent Michael O. Scheinberg
- Main IPC: H01J3/14
- IPC: H01J3/14

Abstract:
An inductively-coupled plasma source for a focused charged particle beam system includes a conductive shield that provides improved electrical isolation and reduced capacitive RF coupling and a dielectric fluid that insulates and cools the plasma chamber. The conductive shield may be enclosed in a solid dielectric media. The dielectric fluid may be circulated by a pump or not circulated by a pump. A heat tube can be used to cool the dielectric fluid.
Public/Granted literature
- US20110272592A1 Encapsulation of Electrodes in Solid Media for use in conjunction with Fluid High Voltage Isolation Public/Granted day:2011-11-10
Information query