Invention Grant
US08643032B2 Light emitting diode package array and method for fabricating light emitting diode package
有权
发光二极管封装阵列及制造发光二极管封装的方法
- Patent Title: Light emitting diode package array and method for fabricating light emitting diode package
- Patent Title (中): 发光二极管封装阵列及制造发光二极管封装的方法
-
Application No.: US13597789Application Date: 2012-08-29
-
Publication No.: US08643032B2Publication Date: 2014-02-04
- Inventor: Masami Nei
- Applicant: Masami Nei
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2011-0086492 20110829
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/50
Abstract:
A light emitting diode (LED) package includes: an array substrate; a plurality of LEDs mounted on the array substrate and arranged in rows and columns; a plurality of wavelength conversion units disposed in a light path of light emitted from each of the plurality of LEDs to convert the wavelength thereof; a plurality of first inspection terminals formed on the array substrate and electrically connected to LEDs in the same rows, among the plurality of LEDs; and a plurality of second inspection terminals formed on the array substrate and electrically connected to LEDs in the same columns, among the plurality of LEDs.
Public/Granted literature
- US20130049033A1 LIGHT EMITTING DIODE PACKAGE ARRAY AND METHOD FOR FABRICATING LIGHT EMITTING DIODE PACKAGE Public/Granted day:2013-02-28
Information query
IPC分类:
