Invention Grant
- Patent Title: Light emitting device array
- Patent Title (中): 发光元件阵列
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Application No.: US13802334Application Date: 2013-03-13
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Publication No.: US08643033B2Publication Date: 2014-02-04
- Inventor: Tatsuma Saito , Mamoru Miyachi
- Applicant: Stanley Electric Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Stanley Electric Co., Ltd.
- Current Assignee: Stanley Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Main IPC: H01L29/18
- IPC: H01L29/18

Abstract:
A light emitting device includes a substrate elongated in a lengthwise direction; a plurality of LED chips disposed on the substrate in an intermediate region in widthwise direction, and aligned along the lengthwise direction at a distance of 80 μm or less; and interconnection wirings formed on regions outside the intermediate region in the widthwise direction; wherein each of the LED chips has a p-side electrode disposed on the substrate, a p-type semiconductor layer disposed on the p-side electrode, an active layer formed on the p-type semiconductor layer, and an n-type semiconductor layer formed on the active layer, and has a region in which the n-type semiconductor layer, the active layer, and the p-type semiconductor layer are patterned, and an n-side electrode formed selectively on a surface of the n-type semiconductor layer and connected to the p-side electrode of an adjacent LED chip through the interconnection wiring.
Public/Granted literature
- US20130248895A1 LIGHT EMITTING DEVICE Public/Granted day:2013-09-26
Information query
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