Invention Grant
- Patent Title: Semiconductor device having glue layer and supporter
- Patent Title (中): 具有胶层和支撑体的半导体装置
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Application No.: US13182916Application Date: 2011-07-14
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Publication No.: US08643075B2Publication Date: 2014-02-04
- Inventor: Wan-Don Kim , Beom-Seok Kim , Yong-Suk Tak , Kyu-Ho Cho , Seung-Hwan Lee , Oh-Seong Kwon , Geun-Kyu Choi
- Applicant: Wan-Don Kim , Beom-Seok Kim , Yong-Suk Tak , Kyu-Ho Cho , Seung-Hwan Lee , Oh-Seong Kwon , Geun-Kyu Choi
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2010-0097361 20101006
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/94

Abstract:
A plurality of metal patterns are disposed on a substrate. A support structure is provided between the plurality of metal patterns. The support structure has a supporter and a glue layer. Each of the plurality of metal patterns has a greater vertical length than a horizontal length on the substrate when viewed from a cross-sectional view. The supporter has a band gap energy of at least 4.5 eV. The glue layer is in contact with the plurality of metal patterns. The supporter and the glue layer are formed of different materials.
Public/Granted literature
- US20120086014A1 Semiconductor Device Having Glue Layer And Supporter Public/Granted day:2012-04-12
Information query
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