Invention Grant
- Patent Title: Semiconductor structure and manufacturing method of the same
- Patent Title (中): 半导体结构及其制造方法相同
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Application No.: US13443417Application Date: 2012-04-10
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Publication No.: US08643078B2Publication Date: 2014-02-04
- Inventor: Shih-Hung Chen , Hang-Ting Lue , Kuang-Yeu Hsieh
- Applicant: Shih-Hung Chen , Hang-Ting Lue , Kuang-Yeu Hsieh
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/788
- IPC: H01L29/788

Abstract:
A semiconductor structure and a manufacturing method of the same are provided. The semiconductor structure includes a base, a stacked structure and a doped layer. The stacked structure is formed on the base, wherein the stacked structure comprises a plurality of conductive strips and a plurality of insulating strips, one of the conductive strips is located between adjacent two insulating strips, the stacked structure has a first side wall, and a long edge of the first side wall is extended along a channel direction. The doped layer is formed in the first side wall, wherein the doped layer is formed by an ion implantation applied to the first side wall, and an acute angle is contained between an implantation direction of the ion implantation and the first side wall.
Public/Granted literature
- US20130264683A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2013-10-10
Information query
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