Invention Grant
- Patent Title: Thickened sidewall dielectric for memory cell
- Patent Title (中): 用于存储单元的增厚的侧壁电介质
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Application No.: US13276600Application Date: 2011-10-19
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Publication No.: US08643082B2Publication Date: 2014-02-04
- Inventor: Ron Weimer , Kyu Min , Tom Graettinger , Nirmal Ramaswamy
- Applicant: Ron Weimer , Kyu Min , Tom Graettinger , Nirmal Ramaswamy
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H01L29/792
- IPC: H01L29/792

Abstract:
Methods and devices are disclosed, such as those involving memory cell devices with improved charge retention characteristics. In one or more embodiments, a memory cell is provided having an active area defined by sidewalls of neighboring trenches. A layer of dielectric material is blanket deposited over the memory cell, and etched to form spacers on sidewalls of the active area. Dielectric material is formed over the active area, a charge trapping structure is formed over the dielectric material over the active area, and a control gate is formed over the charge trapping structure. In some embodiments, the charge trapping structure includes nanodots. In some embodiments, the width of the spacers is between about 130% and about 170% of the thickness of the dielectric material separating the charge trapping material and an upper surface of the active area.
Public/Granted literature
- US20120032252A1 THICKENED SIDEWALL DIELECTRIC FOR MEMORY CELL Public/Granted day:2012-02-09
Information query
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