Invention Grant
US08643115B2 Structure and method of Tinv scaling for high κ metal gate technology
失效
用于高kappa金属栅极技术的Tinv缩放的结构和方法
- Patent Title: Structure and method of Tinv scaling for high κ metal gate technology
- Patent Title (中): 用于高kappa金属栅极技术的Tinv缩放的结构和方法
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Application No.: US13006642Application Date: 2011-01-14
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Publication No.: US08643115B2Publication Date: 2014-02-04
- Inventor: Michael P. Chudzik , Dechao Guo , Siddarth A. Krishnan , Unoh Kwon , Carl J. Radens , Shahab Siddiqui
- Applicant: Michael P. Chudzik , Dechao Guo , Siddarth A. Krishnan , Unoh Kwon , Carl J. Radens , Shahab Siddiqui
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Joseph P. Abate, Esq.
- Main IPC: H01L27/092
- IPC: H01L27/092

Abstract:
A complementary metal oxide semiconductor (CMOS) structure including a scaled n-channel field effect transistor (nFET) and a scaled p-channel field transistor (pFET) which do not exhibit an increased threshold voltage and reduced mobility during operation is provided Such a structure is provided by forming a plasma nitrided, nFET threshold voltage adjusted high k gate dielectric layer portion within an nFET gate stack, and forming at least a pFET threshold voltage adjusted high k gate dielectric layer portion within a pFET gate stack. In some embodiments, the pFET threshold voltage adjusted high k gate dielectric layer portion in the pFET gate stack is also plasma nitrided. The plasma nitrided, nFET threshold voltage adjusted high k gate dielectric layer portion includes up to 15 atomic % N2 and an nFET threshold voltage adjusted species located therein, while the plasma nitrided, pFET threshold voltage adjusted high k gate dielectric layer portion includes up to 15 atomic % N2 and a pFET threshold voltage adjusted species located therein.
Public/Granted literature
- US20120181616A1 STRUCTURE AND METHOD OF Tinv SCALING FOR HIGH k METAL GATE TECHNOLOGY Public/Granted day:2012-07-19
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