Invention Grant
- Patent Title: Substantially L-shaped silicide for contact
- Patent Title (中): 基本上L型硅化物进行接触
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Application No.: US12182212Application Date: 2008-07-30
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Publication No.: US08643119B2Publication Date: 2014-02-04
- Inventor: Zhijiong Luo , Huilong Zhu , Yung Fu Chong , Hung Y. Ng , Kern Rim , Nivo Rovedo
- Applicant: Zhijiong Luo , Huilong Zhu , Yung Fu Chong , Hung Y. Ng , Kern Rim , Nivo Rovedo
- Applicant Address: US NY Armonk SG Singapore
- Assignee: International Business Machines Corporation,Chartered Semiconductor Manufacturing LTD
- Current Assignee: International Business Machines Corporation,Chartered Semiconductor Manufacturing LTD
- Current Assignee Address: US NY Armonk SG Singapore
- Agency: Hoffman Warnick LLC
- Agent Yuanmin Cai
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A structure for a semiconductor device, according to an embodiment, includes: a substantially L-shaped silicide element including a base member and an extended member, wherein the base member extends at least partially into a shallow trench isolation (STI) region such that a substantially horizontal surface of the base member directly contacts a substantially horizontal surface of the STI region; and a contact contacting the substantially L-shaped silicide element.
Public/Granted literature
- US20080283934A1 SUBSTANTIALLY L-SHAPED SILICIDE FOR CONTACT AND RELATED METHOD Public/Granted day:2008-11-20
Information query
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