Invention Grant
- Patent Title: Structure and process for microelectromechanical system-based sensor
- Patent Title (中): 微机电系统传感器的结构与工艺
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Application No.: US13327681Application Date: 2011-12-15
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Publication No.: US08643125B2Publication Date: 2014-02-04
- Inventor: Lung-Tai Chen , Shih-Chieh Lin , Yu-Wen Hsu
- Applicant: Lung-Tai Chen , Shih-Chieh Lin , Yu-Wen Hsu
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Priority: TW100138026A 20111020
- Main IPC: H01L29/78
- IPC: H01L29/78
Abstract:
A structure and a process for a microelectromechanical system (MEMS)-based sensor are provided. The structure for a MEMS-based sensor includes a substrate chip. A first insulating layer covers a top surface of the substrate chip. A device layer is disposed on a top surface of the first insulating layer. The device layer includes a periphery region and a sensor component region. The periphery region and a sensor component region have an air trench therebetween. The component region includes an anchor component and a moveable component. A second insulating layer is disposed on a top surface of the device layer, bridging the periphery region and a portion of the anchor component. A conductive pattern is disposed on the second insulating layer, electrically connecting to the anchor component.
Public/Granted literature
- US20130099331A1 STRUCTURE AND PROCESS FOR MICROELECTROMECHANICAL SYSTEM-BASED SENSOR Public/Granted day:2013-04-25
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