Invention Grant
- Patent Title: High voltage device and manufacturing method thereof
- Patent Title (中): 高压器件及其制造方法
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Application No.: US13037678Application Date: 2011-03-01
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Publication No.: US08643136B2Publication Date: 2014-02-04
- Inventor: Tsung-Yi Huang , Kuo-Hsuan Lo
- Applicant: Tsung-Yi Huang , Kuo-Hsuan Lo
- Applicant Address: TW Chupei, Hsin-Chu
- Assignee: Richtek Technology Corporation
- Current Assignee: Richtek Technology Corporation
- Current Assignee Address: TW Chupei, Hsin-Chu
- Agency: Tung & Associates
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L21/02

Abstract:
The present invention discloses a high voltage device and a manufacturing method thereof. The high voltage device includes: a first conductive type substrate in which isolation regions are formed for defining a device region; a gate formed on the first conductive type substrate; a source and a drain formed in the device region and located at both sides of the gate respectively, and doped with second conductive type impurities; a second conductive type well, which is formed in the first conductive type substrate, and surrounds the drain from top view; and a first deep trench isolation structure, which is formed in the first conductive type substrate, and is located in the second conductive type well between the source and the drain from top view, wherein the depth of the first deep trench isolation structure is deeper than the second conductive type well from the cross-sectional view.
Public/Granted literature
- US20120223384A1 HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-09-06
Information query
IPC分类: