Invention Grant
- Patent Title: Lead frame for assembling semiconductor device
- Patent Title (中): 用于组装半导体器件的引线框架
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Application No.: US13605990Application Date: 2012-09-06
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Publication No.: US08643156B2Publication Date: 2014-02-04
- Inventor: Shunan Qiu , Zhigang Bai , Haiyan Liu
- Applicant: Shunan Qiu , Zhigang Bai , Haiyan Liu
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Priority: CN201210057325 20120306
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/60

Abstract:
A lead frame has a flag, a peripheral frame, and main tie bars coupling the flag to the peripheral frame. At least one cross tie bar extends between two of the main tie bars and an inner row of external connector pads extending from an inner side of the cross tie bar and an outer row of external connector pads extending from an outer side of the cross tie bar. Both an inner non-electrically conductive support bar and an outer non-electrically conductive support bar are attached across the two of the main tie bars. The inner non-electrically conductive support bar is attached to upper surfaces of the two of the main tie bars and to upper surfaces of the inner row of the external connector pads.
Public/Granted literature
- US20130234306A1 LEAD FRAME FOR ASSEMBLING SEMICONDUCTOR DEVICE Public/Granted day:2013-09-12
Information query
IPC分类: