Invention Grant
- Patent Title: Lead frame with grooved lead finger
- Patent Title (中): 引线框架带沟槽铅笔
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Application No.: US13441924Application Date: 2012-04-09
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Publication No.: US08643159B2Publication Date: 2014-02-04
- Inventor: Wai Keong Wong , Kok Leong Chan , Wei Kee Chan
- Applicant: Wai Keong Wong , Kok Leong Chan , Wei Kee Chan
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.
Public/Granted literature
- US20130264693A1 LEAD FRAME WITH GROOVED LEAD FINGER Public/Granted day:2013-10-10
Information query
IPC分类:
