Invention Grant
- Patent Title: Integrated circuit packaging system with leads and method of manufacturing thereof
- Patent Title (中): 具有引线的集成电路封装系统及其制造方法
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Application No.: US13327529Application Date: 2011-12-15
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Publication No.: US08643166B2Publication Date: 2014-02-04
- Inventor: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu
- Applicant: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead bottom body, a lead top body, and a lead top conductive layer directly on the lead top body, the lead top conductive layer having a top protrusion and a top non-vertical portion, the lead bottom body having a horizontally contiguous structure; connecting an integrated circuit to the top protrusion; and forming an encapsulation covering the integrated circuit and exposing a top non-vertical upper side of the top non-vertical portion.
Public/Granted literature
- US20130154115A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-06-20
Information query
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