Invention Grant
- Patent Title: Semiconductor sensor device with over-molded lid
- Patent Title (中): 具有过模制盖的半导体传感器装置
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Application No.: US13292104Application Date: 2011-11-09
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Publication No.: US08643169B2Publication Date: 2014-02-04
- Inventor: Kai Yun Yow , Poh Leng Eu
- Applicant: Kai Yun Yow , Poh Leng Eu
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
A packaged semiconductor device with a cavity formed by a cover or lid mounted to a substrate. The lid covers one or more semiconductor sensor dies mounted on the substrate. The dies are coated with a gel or spray on coating, and the lid is encapsulated with a mold compound. A hole or passage may be formed through the cover and mold compound to expose the sensor dies to selected environmental conditions.
Public/Granted literature
- US20130113054A1 SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME Public/Granted day:2013-05-09
Information query
IPC分类:
