Invention Grant
- Patent Title: Method of assembling semiconductor device including insulating substrate and heat sink
- Patent Title (中): 包括绝缘基板和散热片的半导体器件组装方法
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Application No.: US13442878Application Date: 2012-04-10
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Publication No.: US08643170B2Publication Date: 2014-02-04
- Inventor: Junhua Luo , Jinzhong Yao , Baoguan Yin
- Applicant: Junhua Luo , Jinzhong Yao , Baoguan Yin
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Priority: CN201110094128 20110415
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.
Public/Granted literature
- US20120264258A1 METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBSTRATE AND HEAT SINK Public/Granted day:2012-10-18
Information query
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