Invention Grant
- Patent Title: Heat spreader for center gate molding
- Patent Title (中): 散热器用于中心浇口成型
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Application No.: US11759935Application Date: 2007-06-08
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Publication No.: US08643172B2Publication Date: 2014-02-04
- Inventor: Chee Seng Foong , Aminuddin Ismail , Heng Keong Yip
- Applicant: Chee Seng Foong , Aminuddin Ismail , Heng Keong Yip
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H05K7/20
Abstract:
A heat spreader for an integrated circuit has a base portion and a top portion. The base portion is attachable to a surface of the integrated circuit, and has at least one channel extending therethrough. The top portion that is larger than the base portion such that the heat spreader is generally T-shaped in cross-section. The top portion has a hole at its center that extends from a top surface of the top portion to the at least one channel of the base portion. Mold compound is injected through the hole and out through the channels.
Public/Granted literature
- US20080305584A1 HEAT SPREADER FOR CENTER GATE MOLDING Public/Granted day:2008-12-11
Information query
IPC分类:
