Invention Grant
- Patent Title: Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector
- Patent Title (中): 用于电连接电子设备的连接系统和用于连接导电的第一连接器和导电的第二连接器的方法
-
Application No.: US13152338Application Date: 2011-06-03
-
Publication No.: US08643188B2Publication Date: 2014-02-04
- Inventor: Thilo Stolze , Olaf Kirsch
- Applicant: Thilo Stolze , Olaf Kirsch
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side and a top side spaced apart from the bottom side in a vertical direction. The at least one semiconductor chip is arranged on the top side. Each one of the first connecting elements has a first end which protrudes away from an insulation carrier of the substrate in a direction perpendicular to the vertical direction. The semiconductor system further includes a connecting system with a number of N≧1 connectors. A first one of the connectors includes at least two electrically conductive second connecting elements. Each one of the second connecting elements has a first end. The first end of each one of the first connecting elements is electrically conductively connectable to the first end of one of the second connecting elements.
Public/Granted literature
Information query
IPC分类: