- Patent Title: Semiconductor packages and electronic systems including the same
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Application No.: US13630619Application Date: 2012-09-28
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Publication No.: US08643193B2Publication Date: 2014-02-04
- Inventor: Hye-Jin Kim , Byung-Seo Kim , Sunpil Youn
- Applicant: Hye-Jin Kim , Byung-Seo Kim , Sunpil Youn
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0036731 20090427
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.
Public/Granted literature
- US20130026656A1 SEMICONDUCTOR PACKAGES AND ELECTRONIC SYSTEMS INCLUDING THE SAME Public/Granted day:2013-01-31
Information query
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