Invention Grant
US08643200B2 Resin composition and transparent encapsulant formed using the same, and electronic device including the encapsulant
有权
树脂组合物和使用其形成的透明密封剂，以及包括密封剂的电子装置
- Patent Title: Resin composition and transparent encapsulant formed using the same, and electronic device including the encapsulant
- Patent Title (中): 树脂组合物和使用其形成的透明密封剂，以及包括密封剂的电子装置
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Application No.: US13106353Application Date: 2011-05-12
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Publication No.: US08643200B2Publication Date: 2014-02-04
- Inventor: Shahrokh Motallebi , Sina Maghsoodi , Changsoo Woo , Juneho Shin , Woo Han Kim , Sangran Koh , Hyunjung Ahn , Seunghwan Cha
- Applicant: Shahrokh Motallebi , Sina Maghsoodi , Changsoo Woo , Juneho Shin , Woo Han Kim , Sangran Koh , Hyunjung Ahn , Seunghwan Cha
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: Cheil Indistries, Inc.
- Current Assignee: Cheil Indistries, Inc.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2010-0089979 20100914; KR10-2011-0044204 20110511
- Main IPC: H01L23/29
- IPC: H01L23/29
Abstract:
An embodiment is directed to a polysiloxane having a moiety represented by the following Chemical Formula 1: *—Si-AR—Si—* [Chemical Formula 1] wherein, in the Chemical Formula 1, AR is or includes a substituted or unsubstituted C6 to C30 arylene group.
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