Invention Grant
- Patent Title: Electronic equipment and method for connecting electronic circuit substrate
- Patent Title (中): 电子电路基板连接电子设备及方法
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Application No.: US12989583Application Date: 2009-03-12
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Publication No.: US08643219B2Publication Date: 2014-02-04
- Inventor: Masaaki Yabe , Yoshiaki Koizumi , Toshiyasu Higuma , Noriyuki Kushiro
- Applicant: Masaaki Yabe , Yoshiaki Koizumi , Toshiyasu Higuma , Noriyuki Kushiro
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2008-134266 20080522
- International Application: PCT/JP2009/054711 WO 20090312
- International Announcement: WO2009/142053 WO 20091126
- Main IPC: H01F27/42
- IPC: H01F27/42

Abstract:
Wireless power supply and information communication are achieved between electronic circuit substrates in the electronic equipment, and the size of the circuitry for achieving the above is reduced. There are provided a first electronic circuit substrate, a second electronic circuit substrate, a first coil connected to the first electronic circuit substrate, and a second coil connected to the second electronic circuit substrate. Power is transmitted from the first coil to the second coil by electromagnetic induction so that the first electronic circuit substrate and the second electronic circuit substrate are electrically connected.
Public/Granted literature
- US20110043050A1 ELECTRONIC EQUIPMENT AND METHOD FOR CONNECTING ELECTRONIC CIRCUIT SUBSTRATE Public/Granted day:2011-02-24
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