An IC socket is pneumatically actuated and has an integrated heat sink. Thermally conductive elements of the heat sink extend through an opening of a pneumatically actuated element shaped as a closed curve of finite width so that heat radiating from the thermally conductive elements may dissipate through a top opening of the IC socket. Downward force exerted by the pneumatically actuated element is transferred through a gimbaled multi-plate and spring arrangement to provide even pressure on the die and substrate of an IC device being held in place by the IC socket. A spring-loaded ground tab on the bottom of the IC socket simplifies grounding of the IC socket to avoid damaging the held IC device by static discharge.