Invention Grant
- Patent Title: Non-reflow probe card structure
- Patent Title (中): 非回流探针卡结构
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Application No.: US12762070Application Date: 2010-04-16
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Publication No.: US08643394B2Publication Date: 2014-02-04
- Inventor: Yung-Hsin Kuo
- Applicant: Yung-Hsin Kuo
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/20 ; G01R1/067

Abstract:
In accordance with an embodiment, a probe card structure comprises a base board, a connection interposer over the base board, a substrate over the connection interposer, and a fixture over the substrate securing the substrate and the connection interposer to the base board. The connection interposer comprises interposer electrodes that provide an electrical connection between electrodes on the base board and first electrodes on the substrate.
Public/Granted literature
- US20110254577A1 Non-Reflow Probe Card Structure Public/Granted day:2011-10-20
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