An RF directional coupler fabricated utilizing a printed circuit structure that includes a plated slot or trough as and electrical conduit. The slot intersects a capture pad at the end of the trace. The plating wraps around to this capture pad making the trough a hollow trace. The hollow trace allows a large surface area to be parallel in the same plane. The smooth surface of the routed slot allows for a smooth copper surface unlike a typical wall of a hole or treated copper. These unique vertical edge plated troughs inside the coupler providing two significant advantages over previous coupling techniques. First, the surface area of the lines is greater which greatly increases its power handling capability. Second, the mainline and coupled lines all lie in the same plane simplifying construction of the coupler into a pick and place circuit.