Invention Grant
- Patent Title: Manufacturing method of solid-state imaging apparatus, solid-state imaging apparatus, and electronic imaging apparatus
- Patent Title (中): 固态成像装置,固态成像装置和电子成像装置的制造方法
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Application No.: US12503888Application Date: 2009-07-16
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Publication No.: US08643773B2Publication Date: 2014-02-04
- Inventor: Katsuhisa Mochiduki
- Applicant: Katsuhisa Mochiduki
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2008-210528 20080819
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N9/083 ; C09J7/00

Abstract:
A manufacturing method of a solid-state imaging apparatus includes the steps of: preparing a solid-state imaging device having a light receiving region at a main surface thereof; preparing a light transmitting member having an extending portion extending from the solid-state imaging device; preparing a holding member having a space for holding the solid-state imaging device therein, and having a positioning portion for positioning the solid-state imaging device; fixing the light transmitting member to the main surface of the solid-state imaging device in parallel to each other to keep a constant interval therebetween; bringing a side of the solid-state imaging device to meet the positioning portion of the holding member; and fixing the extending portion of the light transmitting member to the holding member.
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