Invention Grant
- Patent Title: Integrated circuit film for smart card
- Patent Title (中): 智能卡集成电路膜
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Application No.: US12976714Application Date: 2010-12-22
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Publication No.: US08644025B2Publication Date: 2014-02-04
- Inventor: Huan Chin Luo , Hua Ting Chang , Chin Sheng Lin , Chih Cheng Lin , Chung Pei Hung
- Applicant: Huan Chin Luo , Hua Ting Chang , Chin Sheng Lin , Chih Cheng Lin , Chung Pei Hung
- Applicant Address: TW Hsinchu
- Assignee: Mxtran Inc.
- Current Assignee: Mxtran Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Liu & Liu
- Priority: TW098144154 20091222; TW099215445 20100812; TW099221068 20101101
- Main IPC: H05K1/14
- IPC: H05K1/14
Abstract:
An integrated circuit (IC) film for a smart card is provided. The IC film includes a flexible printed circuit (FPC) board, first electrical contacts, second electrical contacts, and an IC chip. The first electrical contacts are disposed on a first side of the FPC board, and the second electrical contacts are disposed on a second side of the FPC board. The IC chip is disposed on the FPC board and bonded to the leads of the FPC board to thereby form electrical connection. The total thickness of the FPC board and the chip is not larger than 0.5 mm.
Public/Granted literature
- US20110149533A1 INTEGRATED CIRCUIT FILM FOR SMART CARD Public/Granted day:2011-06-23
Information query
