Invention Grant
- Patent Title: Multi-chip package and method of operating the same
- Patent Title (中): 多芯片封装和操作方法相同
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Application No.: US13243223Application Date: 2011-09-23
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Publication No.: US08644092B2Publication Date: 2014-02-04
- Inventor: Kyoung Nam Kim , Beom Ju Shin
- Applicant: Kyoung Nam Kim , Beom Ju Shin
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2010-0122905 20101203
- Main IPC: G11C7/06
- IPC: G11C7/06

Abstract:
A semiconductor memory device includes a memory cell array including first memory cells for storing data and second memory cells for storing chip identification (ID) information, a data comparison circuit configured to compare input data and the stored data of the first memory cells and to output comparison data, and output circuits configured to output the comparison data received in parallel from the data comparison circuit. The comparison data is outputted through a selected one of the output circuits according to an enable signal generated based on the chip ID information.
Public/Granted literature
- US20120140577A1 MULTI-CHIP PACKAGE AND METHOD OF OPERATING THE SAME Public/Granted day:2012-06-07
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