Invention Grant
US08644092B2 Multi-chip package and method of operating the same 有权
多芯片封装和操作方法相同

Multi-chip package and method of operating the same
Abstract:
A semiconductor memory device includes a memory cell array including first memory cells for storing data and second memory cells for storing chip identification (ID) information, a data comparison circuit configured to compare input data and the stored data of the first memory cells and to output comparison data, and output circuits configured to output the comparison data received in parallel from the data comparison circuit. The comparison data is outputted through a selected one of the output circuits according to an enable signal generated based on the chip ID information.
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