Invention Grant
- Patent Title: Alignment method for assembling substrates without fiducial mark
- Patent Title (中): 用于组装没有基准标记的基板的对准方法
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Application No.: US13352323Application Date: 2012-01-17
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Publication No.: US08644591B2Publication Date: 2014-02-04
- Inventor: Chorng-tyan Lin , Chih-chin Wen , Chun-ming Yang , Jwu-jiun Yang
- Applicant: Chorng-tyan Lin , Chih-chin Wen , Chun-ming Yang , Jwu-jiun Yang
- Applicant Address: TW Kaohsiung
- Assignee: Metal Industries Research & Development Centre
- Current Assignee: Metal Industries Research & Development Centre
- Current Assignee Address: TW Kaohsiung
- Agent Cheng-Ju Chiang
- Priority: TW100145345A 20111208
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment.
Public/Granted literature
- US20130148878A1 ALIGNMENT METHOD FOR ASSEMBLING SUBSTRATES WITHOUT FIDUCIAL MARK Public/Granted day:2013-06-13
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