Invention Grant
- Patent Title: Opto-electronic transceiver module with housing having thermally conductive protrusion
- Patent Title (中): 具有导热突起的壳体的光电收发器模块
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Application No.: US13167530Application Date: 2011-06-23
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Publication No.: US08644712B2Publication Date: 2014-02-04
- Inventor: Seng-Kum Chan , David J. K. Maedowcroft
- Applicant: Seng-Kum Chan , David J. K. Maedowcroft
- Applicant Address: SG
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG
- Main IPC: H04B10/40
- IPC: H04B10/40 ; H04B10/00
Abstract:
An opto-electronic communication module includes a housing, a circuit substrate, and an opto-electronic communication device, such as a laser, mounted on the circuit substrate. A protrusion that is unitarily formed in the housing extends through the circuit substrate to provide a thermal path to promote dissipation of heat emitted by the opto-electronic communication device.
Public/Granted literature
- US20120327668A1 OPTO-ELECTRONIC TRANSCEIVER MODULE WITH HOUSING HAVING THERMALLY CONDUCTIVE PROTRUSION Public/Granted day:2012-12-27
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