Invention Grant
- Patent Title: Methods of forming sealed devices containing heat sensitive components
- Patent Title (中): 形成包含热敏组分的密封装置的方法
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Application No.: US12597381Application Date: 2008-04-23
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Publication No.: US08644935B2Publication Date: 2014-02-04
- Inventor: C. Roger Leigh
- Applicant: C. Roger Leigh
- Applicant Address: AU Macquarie University, NSW
- Assignee: Cochlear Limited
- Current Assignee: Cochlear Limited
- Current Assignee Address: AU Macquarie University, NSW
- Agency: Kilpatrick, Townsend & Stockton, LLP.
- Priority: AU2007902123 20070423
- International Application: PCT/AU2008/000579 WO 20080423
- International Announcement: WO2008/131484 WO 20081106
- Main IPC: A61N1/372
- IPC: A61N1/372
Abstract:
An implantable device is provided. The device is constructed from an open body containing electronic components, a heat-sensitive component, and a sealing component. The device is formed in a moisture controlled environment, such that the heat-sensitive component is attached to the open enclosure after the enclosure has been heated. The sealing component is subsequently affixed to the open enclosure to form a sealed enclosure.
Public/Granted literature
- US20110106188A1 IMPLANT ASSEMBLY Public/Granted day:2011-05-05
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