Invention Grant
- Patent Title: Heating element location optimization
- Patent Title (中): 加热元件位置优化
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Application No.: US12997746Application Date: 2008-06-30
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Publication No.: US08644979B2Publication Date: 2014-02-04
- Inventor: Youneng Wang , Christopher S. Madden , Michael C. Andrews
- Applicant: Youneng Wang , Christopher S. Madden , Michael C. Andrews
- Applicant Address: CH Granges-Paccot
- Assignee: Michelin Recherche et Technique S.A.
- Current Assignee: Michelin Recherche et Technique S.A.
- Current Assignee Address: CH Granges-Paccot
- Agency: Dority & Manning, P.A.
- International Application: PCT/US2008/068729 WO 20080630
- International Announcement: WO2010/002380 WO 20100107
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A method for optimizing the location of heating elements within a mold for a rubber article. The position of one or more heating elements, e.g., curing pins or sipes, within the tread mold for a tire can be determined using a 3-D temperature profile so as to improve the efficiency of the curing process. For purposes of the optimization, the number of possible locations for such heating elements can be varied depending upon e.g., the computational time and accuracy desired.
Public/Granted literature
- US20110098836A1 HEATING ELEMENT LOCATION OPTIMIZATION Public/Granted day:2011-04-28
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