Invention Grant
- Patent Title: System of interconnections for external functional blocks on a chip provided with a single configurable communication protocol
- Patent Title (中): 具有单个可配置通信协议的芯片上的外部功能块的互连系统
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Application No.: US11482175Application Date: 2006-07-06
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Publication No.: US08645557B2Publication Date: 2014-02-04
- Inventor: Cesar Douady , Philippe Boucard
- Applicant: Cesar Douady , Philippe Boucard
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Technologies, Inc.
- Current Assignee: QUALCOMM Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: FR0603248 20060412
- Main IPC: G06F15/16
- IPC: G06F15/16

Abstract:
The system of interconnections (20) for external functional blocks on a chip provided with a single configurable communication protocol, comprises two physically separate communication networks (21, 22): a request network (21) for transmitting request messages from an initiating block (23, 24, 25, 26) to a recipient block (27, 28, 29, 30, 31) and a response network (22) for transmitting response messages from a recipient block (27, 28, 29, 30, 31) to an initiating block (23, 25, 26). The response messages include additional information making said request (21) and response (22) networks able to respectively manage the request messages and the response messages independently.
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